- MoU Signals Strategic Shift Towards Integrated Semiconductor Ecosystem in India
- Design Meets OSAT Strength to Build Scalable Domestic Manufacturing Backbone
- Focus on QFN40 & QFN64 Packages for IoT, Wearables and Smart Displays
- 10 Million Units Planned for Global Client; Additional 5 Million Annually in Pipeline
- Partnership Aligns with National Push for Semiconductor Self-Reliance
- From Innovation to Execution: Bridging India’s Chip Design–Manufacturing Gap
NE BUSINESS BUREAU
AHMEDABAD, MAR 31
In a significant stride towards strengthening India’s semiconductor ecosystem, IndiesemiC Private Limited has signed a Memorandum of Understanding (MoU) with Kaynes Semicon Private Limited, a leading Outsourced Semiconductor Assembly and Test (OSAT) facility based in Sanand, Gujarat.
The collaboration brings together chip design and backend manufacturing capabilities within India, creating a structured pathway for qualification, assembly, and testing of semiconductor packages including QFN40, QFN64, and other mutually agreed formats. It is aimed at supporting IndiesemiC’s growing portfolio of ultra-low power System-in-Package (SiP) modules and System-on-Chip (SoC) solutions.
Commenting on the development, Nikul Shah, Founder & CTO, IndiesemiC Private Limited, said: “This collaboration with Kaynes Semicon is an important step in strengthening the backend manufacturing readiness required to support India’s growing semiconductor ambitions. As a chip design company building solutions for next-generation electronics, it is critical for us to work closely with capable domestic partners who can support package development, qualification, and scalable execution.”
He further added: “The semiconductor industry is increasingly moving towards tighter integration between design, packaging, and deployment. In that context, partnerships like these are not just commercially relevant, but strategically important for India. They help create the ecosystem depth needed to move from isolated capabilities to a more complete and resilient semiconductor value chain. We believe this collaboration will support faster productisation, better alignment between innovation and manufacturing, and ultimately contribute to India’s long-term semiconductor self-reliance.”
The MoU aims to establish a scalable and reliable manufacturing pathway for IndiesemiC’s semiconductor products by leveraging Kaynes Semicon Private Limited’s advanced OSAT infrastructure and packaging expertise. At a time when global supply chain disruptions are reshaping manufacturing strategies, the partnership reflects a shared vision to strengthen local value chains and reduce external dependencies.
As part of its initial roadmap, the collaboration will focus on QFN40 and QFN64 packages, enabling applications across IoT, wearables, and display-led technologies, while laying the groundwork for future expansion into additional package formats.
IndiesemiC plans to manufacture 10 million units over the next three years for a global customer, alongside an additional 5 million units annually for other clients—underscoring both the commercial scale and growing maturity of India’s semiconductor design ecosystem.
IndiesemiC Private Limited continues to expand its footprint through low-power, compact, and high-performance chip solutions tailored for emerging sectors such as IoT, smart electronics, and embedded systems. With a focus on innovation and localisation, the company represents a new wave of Indian semiconductor players contributing to the country’s technology ambitions.
The MoU between IndiesemiC Private Limited and Kaynes Semicon Private Limited goes beyond a business agreement—it reflects the accelerating momentum in India’s semiconductor journey. By integrating design excellence with manufacturing capability, the partnership is poised to strengthen product development, localisation, and scale, shaping a resilient and globally competitive semiconductor ecosystem.
